Top surface imaging technique for top pole tip width control in magnetoresistive read/write head processing
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United States of America Patent
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Jul 9, 2002
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app pub date -
Sep 28, 2000
filing date -
Oct 23, 1998
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Abstract
A top surface imaging technique for top pole tip width control in a magnetoresistive ('MR') or giant magnetoresistive ('GMR') read/write head is disclosed in which a multi-layer structure is employed to define the thick photoresist during processing resulting in much improved dimensional control. To this end, a relatively thin upper photoresist layer is patterned with much improved resolution, an intermediate metal or ceramic layer is then defined utilizing the upper photoresist layer as a reactive ion etching ('RIE') mask, with the intermediate layer then being used as an etching mask to define the bottom-most thick photoresist layer in a second RIE process. As a consequence, a much improved sub-micron pole tip width along with a high aspect ratio and vertical profile is provided together with much improved critical dimension control.
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