System and method for transporting and sputter coating a substrate in a sputter deposition system
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United States of America Patent
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-
Jun 18, 2002
Issued Date -
N/A
app pub date -
May 25, 2001
filing date -
Apr 12, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A plasma sputtering system is described. A substrate handling system thereof places an unprocessed substrate (e.g., an optical disk), an inner mask, and an outer mask onto a tray in a loadlock of the sputtering system, and then seals the access opening to the loadlock. The substrate and the masks are moved on the tray to a sputtering chamber where the substrate is sputter coated. The substrate handing system removes the processec substrate and accompanying inner and outer masks from the tray in the loadlock to an external substrate change station, where the processed substrate is removed from the masks, which are still gripped by the substrate handling system. Another unprocessed disk is placed on the inner mask and within the outer mask, and the sequence repeats. The substrate handling system only contacts the masks on surfaces thereof that are not subjected to direct sputter deposition.
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