Ultra high density integrated circuit BLP stack and method for fabricating the same
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United States of America Patent
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Jun 4, 2002
Grant Date -
Nov 15, 2001
app pub date -
May 4, 2001
filing date -
May 6, 1998
priority date (Note) -
Expired
status (Latency Note)
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Abstract
BLP stack is disclosed which has a higher reliability and a less area of mounting for providing a denser package, including a first package having external power connection leads each started to be exposed through a bottom thereof and extended to a top surface through a side surface inclusive of bottom lead portions on a bottom surface, side lead portions on a side surface, and upper lead portions on a top surface, and a second package having external power connection leads started to be exposed through a bottom thereof and brought into contact with the external power connection leads on the first package to be electrically connected thereto.
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