Thermal diode for energy conversion
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United States of America Patent
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May 28, 2002
Grant Date -
N/A
app pub date -
Nov 22, 2000
filing date -
Mar 11, 1999
priority date (Note) -
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Abstract
Solid state thermionic energy converter semiconductor diode implementation and method for conversion of thermal energy to electric energy, and electric energy to refrigeration. In embodiments of this invention a highly doped n* region can serve as an emitter region, from which carriers can be injected into a gap region. The gap region can be p-type, intrinsic, or moderately doped n-type. A hot ohmic contact is connected to the n*-type region. A cold ohmic contact serves as a collector and is connected to the other side of the gap region. The cold ohmic contact has a recombination region formed between the cold ohmic contact and the gap region and a blocking compensation layer that reduces the thermoelectric back flow component. The heated emitter relative to the collector generates an EMF which drives current through a series load. The inventive principle works for hole conductivity, as well as for electrons.

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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
MICROPOWER GLOBAL LIMITED | GENEVA PLACE WATERFRONT DRIVE PO BOX 3175 ROAD TOWN TORTOLA |
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Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Hagelstein, Peter L | Farmington, MA | 104 | 2250 |
Kucherov, Yan R | Salt Lake City, UT | 19 | 515 |
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Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
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Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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