Microwave packaging having patterned adhesive; and methods
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United States of America Patent
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May 28, 2002
Grant Date -
N/A
app pub date -
Nov 16, 2000
filing date -
Nov 19, 1999
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Abstract
A microwave popcorn package is provided. The package has an inner ply and an outer ply of flexible material, such as paper, with a microwave interactive construction therebetween. The plies are bonded together with a laminating adhesive that is applied in a regular pattern of polygonal adhesive areas. This pattern occupies at least 80 square inches (516 cm.sup.2) of the surface between the plies, and provides no more than 50% adhesive coverage of that area where the pattern is located. The adhesive polygons can be squares or diamonds. A second adhesive pattern can be present in a second portion of the ply surface.
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