Multi-layered substrate with a built-in capacitor design
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United States of America Patent
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May 28, 2002
Grant Date -
N/A
app pub date -
May 16, 2000
filing date -
May 16, 2000
priority date (Note) -
Expired
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Abstract
A multi-layered substrate having built-in capacitors is used to decouple high frequency noise generated by voltage fluctuations between a power plane and a ground plane of a multi-layered substrate. At least one kind of dielectric material, which is filled in through holes between the power plane and the ground plane, with high dielectric constant is used to form the built-in capacitors.
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