Method for improving the liquid dispensing of IC packages
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United States of America Patent
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May 28, 2002
Grant Date -
May 10, 2001
app pub date -
Dec 26, 2000
filing date -
Dec 22, 1998
priority date (Note) -
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Abstract
A flat plate mold with special treatment or a metallic flat plate mold is adopted to flatten the resin painted over on IC chips during package dispensing process, such that it is able to maintain a consistent flatness of the surface of IC products after dispensing for laser or ink marking. And heat sinks can be attached to the flat plate mold to increase the heat-dissipating rate of IC products after dispensing.
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