Abrasive tools for grinding electronic components
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United States of America Patent
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May 28, 2002
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N/A
app pub date -
May 28, 1999
filing date -
May 28, 1999
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Abstract
Abrasive tools containing high concentrations of hollow filler materials in a resin bond are suitable for polishing and backgrinding of hard materials, such as ceramic wafers and components requiring a controlled amount of surface defects. These highly porous abrasive tools comprise fine grit abrasive grain, such as diamond abrasive, along with the hollow filler material and resin bond.
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