Dielectric member for absorbing thermal expansion and contraction at electrical interfaces
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United States of America Patent
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May 28, 2002
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N/A
app pub date -
Oct 29, 1998
filing date -
Oct 29, 1998
priority date (Note) -
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Abstract
The invention is directed to a dielectric member interposed between two electrical components which have different coefficients of thermal expansion (CTEs). The dielectric member has conductive traces for electrically connecting the electrical components. The traces may be joined by solder balls to a printed circuit board. The dielectric member may include reservoirs for locating the solder balls and receiving solder after reflow of the solder balls. Adhesive layers may be used for bonding the traces to the dielectric member. The dielectric member is made of a material having a selected CTE value which minimizes the CTE mismatch at the electrical interface and effectuates absorption of the thermal expansion and contraction of the system. Stresses induced by thermal expansion and contraction at the electrical interface are thereby reduced, preventing problems such as fractured solder joints.
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