Semiconductor device having protruding electrodes higher than a sealed portion
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United States of America Patent
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May 14, 2002
Grant Date -
N/A
app pub date -
Jun 27, 2000
filing date -
Nov 30, 1999
priority date (Note) -
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Abstract
A plurality of semiconductor devices can be mounted on a mounting board in a three-dimensional structure by stacking one on another with a simple structure. A semiconductor element is mounted on a first surface of an interposer. Electrode pads connected to the semiconductor element are arranged around the semiconductor element on the first surface of the interposer. Protruding electrodes are provided on the respective electrode pads. Through holes are formed in the interposer so as to extend from a second surface opposite to the first surface of the redistribution substrate to the respective electrode pads. The semiconductor element is encapsulated by a seal resin. Each of the protruding electrodes is higher than the sealed portion of the semiconductor element.
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