Submountless integrated optics chip package

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6385359
SERIAL NO

09223088

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An Integrated Optics Chip (IOC) package for an IOC, including a base having an upper support surface having a first raised surface and a dielectric gel disposed on the first raised surface of the base and adapted to couple to the IOC. The dielectric gel is sufficiently compliant to minimize stresses from structural changes in the base, accommodate a thermal mismatch between the IOC and the base, and reduce vibration. A first adhesive may be applied to a platform integral to the base that is sufficiently rigid to prevent the IOC from separating from the dielectric gel during vibration. A second adhesive may be applied on a second raised surface of the base to provide strain relief to the leads of the IOC. Advantages include the elimination of several components and manufacturing steps, improved strain relief and vibration dampening, as well as manufacturing time and cost savings.

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Patent Owner(s)

Patent OwnerAddress
HONEYWELL INCHONEYWELL PLAZA MN12-8251 P O BOX 524 MINNEAPOLIS MN 55440

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fetting, Karl A Glendale, AZ 8 46
Hung, Henry H Paradise Valley, AZ 13 288
Shannon, John H Scottsdale, AZ 14 456
Vaught, Jesse A Phoenix, AZ 3 41

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