Multi-board BGA package
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United States of America Patent
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May 7, 2002
Grant Date -
N/A
app pub date -
Jul 5, 2001
filing date -
Jul 5, 2001
priority date (Note) -
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Abstract
A multi-board BGA package comprises a chip, a plurality of circuit boards, a plurality of metal bonding wires, a plurality of solder balls, and a package body. The circuit boards are formed on a same plane. Between adjacent circuit boards there is a galley for passing through metal bonding wires to connect chip with circuit board and molding package body easily. The plurality of circuit boards together hold the chip so as to reduce thermal stress caused by CTE mismatch.
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