High density analog interface
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United States of America Patent
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May 7, 2002
Grant Date -
N/A
app pub date -
May 15, 2001
filing date -
May 15, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An interface module includes a high density analog interface (HAI) for electrical interconnection between a programmable logic controller (PLC) and an analog to digital converter (ADC) or a digital to analog converter (DAC). The HAI includes a single application specific integrated circuit having a data scaling function block, a diagnostics function block configured to verify functionality of said scaling function block, a self-calibration function block configured to compensate for drift in said ADC, and a shared interface function block configured to electronically connect said module with a programmable logic controller (PLC).
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