Printed wiring board and manufacturing method thereof
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United States of America Patent
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-
May 7, 2002
Grant Date -
N/A
app pub date -
Sep 7, 1999
filing date -
Sep 21, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A printed wiring board with an increased strength of solder is provided by preventing solder bridge formation and increasing the amount of solder adherent thereto. A land (1) serving as a soldering foundation is formed in a star-shape, to minimize the proximal peripheral length (L2) between adjacent lands spaced distance (L1) apart, thus reducing the possibility of solder bridge formation. Since the star-shaped land (1) has a greater area than a rhombic land of identical size, the amount of solder adherent thereto is greater than that of the rhombic land, thus enabling to increase the strength of solder.
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