Method of tab alignment in an integrated circuit type device
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United States of America Patent
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May 7, 2002
Grant Date -
N/A
app pub date -
Jul 10, 1998
filing date -
Jul 15, 1997
priority date (Note) -
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Abstract
An integrated circuit type device having a series of bond pads for the interconnection of the device with external power or communication lines, a method of improving the registration accuracy of the interconnection comprising the step of forming a guide rail on the device spaced adjacent to the bond pads for abutting the external power and communication lines against so as to accurately position the lines for interconnection with the bond pads. Preferably, the bond pads are arranged in a line along one edge of the integrated circuit type device and the lines are in the form of a Tape Automated Bonding strip. The guide rail can be formed utilising a standard micromechanical systems deposition process and is ideally utilized in a pagewidth ink jet printing system.
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