System for improving the total thickness variation of a wafer

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6379490
SERIAL NO

08596980

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A system for improving the total thickness variation across a surface of a bulk semiconductor wafer includes an initial total thickness variation measuring instrument. The initial total thickness variation profile is then converted to a dwell time versus position map. A confined plasma is then used to selectively locally remove material from the surface so that the final surface of the bulk semiconductor has an improved final total thickness variation.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
NOVELLUS SYSTEMS INC4650 CUSHING PARKWAY FREMONT CA 94538

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bollinger, L David Ridgefield, CT 5 436
Nester, James F Ridgefield, CT 4 46
Zarowin, Charles B Studio City, CA 11 652

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation