Microencapsulated adhesive
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 23, 2002
Grant Date -
N/A
app pub date -
Nov 17, 1992
filing date -
Nov 17, 1992
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A microencapsulated adhesive and a method for producing that microencapsulated adhesive is disclosed. The adhesive is produced from an alkyl acrylate or methacrylate monomer having about 4 to about 12 carbon atoms, or a mixture thereof. The monomer is encapsulated by interfacial polymerization, gelatin/gum arabic coacervation or melamine/formaldehyde encapsulation. The microcapsules may be polyamide or polyurea. The monomer is polymerized in the microcapsules by heating to form an adhesive that is non-tacky, but becomes tacky upon application of external forces, such as shearing. The microencapsulated adhesive composition may be used, among other applications, as an adhesive for stamps or envelopes.
First Claim
Other Claims data not available