Printed circuit board and method for its manufacture
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United States of America Patent
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Apr 9, 2002
Grant Date -
N/A
app pub date -
Aug 24, 1999
filing date -
Aug 25, 1998
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An optoelectronic, multilayer printed circuit board having at least one layer to be fitted with components. The printed circuit board having an electrical printed circuit trace on the exterior of the layer structure and optical signal-transmission paths which are patterned as integrated multimode waveguides in a system having additional, optically transparent layers. According to this structure, a cost-effective implementation is achieved with respect to optical multimode interconnect lines with passive structures, coupling points for optical fibers and for optoelectronic components for transmitting and receiving optical signals, and conventional electrical signaling links on a shared carrier. The transparent layers are located in the interior of the layer structure, and largely conventional methods are used to pattern these layers.
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