Multi-layer planar inductance coil and a method for producing the same
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United States of America Patent
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Apr 9, 2002
Grant Date -
N/A
app pub date -
Jan 7, 2000
filing date -
Jul 10, 1997
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The invention relates to a multi-layer planar inductance coil on a portion of a first plate-shaped support (10) which has a plurality of first conducting layers (14) which extend substantially parallel to each other and which is designed for holding and contacting further electronic components (32), wherein at least one conducting layer (14) of the first support, which forms a first electrical winding, is arranged for co-operation with a core (24) which is provided for guiding a magnetic flux and which is to be arranged in the portion, wherein at least one second plate-shaped support (20; 22; 44; 54) with a plurality of second conducting layers (16; 18) which extend substantially parallel to each other is so arranged in the portion parallel to the first support (10) that at least one conducting layer (16) of the second support, which provides a second electrical winding, can inductively co-operate with the core (24) and the first electrical winding.
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