Process for stacking layers that form a multilayer printed circuit
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 9, 2002
Grant Date -
N/A
app pub date -
Apr 18, 2000
filing date -
Apr 18, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A process for correctly positioning layers of a multilayer printed circuit. A flat closed circuit is attached peripherally on each layer. Each layer is arranged parallel to multiple circuits that are fixed on a reference board. An alternating current flows in one of the fixed circuits. The alternating current electromagnetically induces a current in the flat closed circuit, which in turn electromagnetically induces electromotive forces in other fixed circuits. The characteristic values of the electromotive forces are a function of the relative positions of the fixed circuits with respect to the flat, closed circuit. These values are used to correct the position of each layer on which the circuit is attached until each layer or parts of each layer are stacked in a predetermined position relative to at least parts of the fixed circuits. The corrected position is the position which each layer must maintain in the multilayer circuit. The layers are secured by hot soldering of interposed sheets of synthetic resin.
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- B23K Class
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