Method of adhering wafers and wafer adhering device
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United States of America Patent
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Apr 9, 2002
Grant Date -
N/A
app pub date -
Apr 26, 1999
filing date -
May 1, 1998
priority date (Note) -
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Abstract
The method and the device of the present invention are capable of uniformly using whole surface of a carrying plate, improving the polishing accuracy of wafers and extending span of life of the carrying plate. The method of adhering a plurality of wafers onto a surface of a carrying plate with predetermined spaces is characterized by regularly shifting wafer adhering positions, at which the wafers are respectively adhered, with respect to a standard position of the carrying plate, in the surface of the carrying plate. The wafer adhering position is regularly shifted when the carrying plate is exchanged or predetermined time elapses.
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