Photosensitive polymer composition, method for forming relief patterns, and electronic parts
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United States of America Patent
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Apr 2, 2002
Grant Date -
Jul 26, 2001
app pub date -
Feb 6, 2001
filing date -
May 29, 1998
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Abstract
Disclosed are a photosensitive polymer composition comprising (a) a polymer soluble in an aqueous alkaline solution, (b) an o-quinonediazide compound, and (c) a dissolution inhibitor for the component (a) in an aqueous alkaline solution; a method of using the composition for forming relief patterns; and electronic parts having, as a passivating film or an interlayer insulating film, the relief pattern as formed in the method. The composition has high sensitivity, and give fine relief patterns having a good profile.
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