Closure mechanism with a heat-insulating filler
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United States of America Patent
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-
Mar 26, 2002
Grant Date -
N/A
app pub date -
Jan 16, 1998
filing date -
Jan 16, 1998
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A heat insulating filler is mixed into the attachment layer of a resealable closure mechanism for a package. A heat and pressure sealing process is used to attach the closure profile to a resealable package. A heat-sealing bar is used to apply a heat load into the attachment layer causing the attachment layer to fuse with the film of the package. The heat insulating filler insulates the profile layer from the heat load to prevent distorting or melting of the profile layer. The heat insulating filler also supports the profile members perpendicular to their respective base strips to facilitate opening and closing of the resealable package.
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