Apparatus and method for assessing solderability
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United States of America Patent
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Mar 26, 2002
Grant Date -
N/A
app pub date -
Jan 26, 1999
filing date -
Jan 26, 1999
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Expired
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Abstract
The invention is an apparatus and method for assessing the solderability of electronic component leads and adjacent mounting surfaces. The apparatus and method enables assessment of solderability of fine pitch surface mount components that may be 'leadless' or have such small leads that other methods are unable to make measurements required for assessing solderability. The invention also provides a reliable automated test technology for electronic component solderability. It is based on the use of measurements of the distinctive changes in the IR radiation signal of a wetted soldered connection during the solder reflow process, resulting from rapid changes in emissivity of the materials. This is accomplished through the use of an IR camera connected to a computer, and a substrate heater controlled by the computer to achieve a predetermined temperature profile at the component leads.
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