Hybrid chip process
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United States of America Patent
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Mar 19, 2002
Grant Date -
N/A
app pub date -
Oct 18, 1999
filing date -
Jan 7, 1997
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present case concerns the manufacture of hybrid electrooptical chips. A substrate is treated so that it can both provide locations for electrooptical components and be etched so as to generate grooves in which optical fibers can be mounted. During the etching of the grooves any electrooptical component already mounted on the substrate is protected from damage by the etchant by a protective coating. A feature is that optical fibers can be mounted with their cores above the surface of the wafer.
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