Method and apparatus for removal of solder
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United States of America Patent
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Mar 19, 2002
Issued Date -
N/A
app pub date -
Jan 24, 2000
filing date -
Jan 25, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The invention relates to a method and an apparatus (22) for removing solder from a circuit board (5) from which electrical or electronic components have been removed at soldering points. The invention is addressed to the problem of offering a method and an apparatus by which the residual solder can be entirely removed from the circuit board (5) and by which even a large area on the circuit board (5) can be freed quickly and easily of the residual solder. This problem is solved by a method in which the solder after melting is pushed away from the soldering points by at least one pushing means (13a) or displaced therefrom by a plunger element, and is then removed from the circuit board (5). The apparatus (22) according to the invention makes available the means needed for the purpose.
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