Workpiece cutting method for use with dicing machine
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United States of America Patent
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Mar 12, 2002
Grant Date -
N/A
app pub date -
Dec 2, 1998
filing date -
Dec 2, 1997
priority date (Note) -
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status (Latency Note)
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Abstract
Two blades are arranged oppositely at a predetermined interval along the Y-axis. The two blades cut a wafer along two cutting lines at the same time while the two blades are moving along the X-axis. After the wafer is cut along these two cutting lines, the two blades are moved along the Y-axis by one pitch of the cutting lines so that the wafer can be cut along the next two cutting lines. This action is repeated to cut the wafer along the cutting lines continuously. This wafer cutting method can hold the movement of the blades along the X-axis to a minimum because of the oppositely-arranged two blades. Consequently, the wafer can be cut in a short period of time.
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