Connector-mounted substrate and method for assembling the same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Mar 12, 2002
Grant Date -
N/A
app pub date -
Mar 15, 1999
filing date -
Mar 16, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of surface-mounting a connector on a circuit board using a rivet as a mounting member is provided. This method can provide an excellent assembling process by, if necessary, using the conventional solder dipping process or rivet caulking process. A rivet has a middle portion acting as a flange. In the rivet, one end is previously fixed to a connector side while the other end is inserted into a first hole formed in the surface of a circuit board, so that the flange can be closely attached to the circuit board. Particularly, since a soldering pad is formed adjacent to a hole formed in the circuit board, the rivet can be bonded to the circuit board while other electronic components are being surface-soldered on the circuit board.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully