Press-forming die for glass elements
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United States of America Patent
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Mar 12, 2002
Grant Date -
N/A
app pub date -
Dec 14, 1998
filing date -
Dec 16, 1997
priority date (Note) -
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Abstract
A platinum thin film having a thickness of 0.01 to 5 .mu.m is formed by means of the sputtering method on a press face of a die based on the use of a cemented carbide base material. A nickel thin film having a thickness of 0.05 to 0.5 .mu.m and a thin film made of an alloy of platinum and iridium are allowed to intervene between the cemented carbide base material and the platinum thin film, if necessary. Alternatively, an alloy thin film having a thickness of 0.01 to 5 .mu.m, which contains 10 to 70% by weight of iridium and 30 to 90% by weight of one or more species of metals selected from metals of the platinum group except for iridium, may be allowed to intervene between the cemented carbide base material and the platinum thin film.
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