Epoxy resin and epoxy di (meth)acrylate from hydroxyaliphatic bisphenol
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United States of America Patent
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Mar 5, 2002
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N/A
app pub date -
Jul 26, 2000
filing date -
Aug 3, 1999
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Expired
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Abstract
The present invention concerns hydroxyaliphatic functional diglycidyl ethers of bisphenols (epoxy resins); curable (thermosettable) mixtures of at least one hydroxyaliphatic functional epoxy resin and at least one curing agent and/or catalyst therefor, as well as cured (thermoset) compositions prepared therefrom; and derivatives prepared therefrom. The bisphenol precursor to the diglycidyl ether contains a hydroxyaliphatic group linkage between the two aromatic rings of the bisphenol.
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