Method for manufacturing semiconductor package containing cylindrical type bump grid array
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United States of America Patent
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Mar 5, 2002
Issued Date -
N/A
app pub date -
Oct 6, 2000
filing date -
Dec 30, 1997
priority date (Note) -
Expired
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Abstract
A method for manufacturing a semiconductor package comprising the steps of (a) forming a plurality of bumps on a metal frame and a bridge for connecting and supporting the bumps, (b) coating liquid solder on the bumps, (c) aligning the frame with respect to a semiconductor substrate where patterns are formed so that the bumps are positioned on the patterns, (d) soldering the bumps on the patterns, and (e) separating the bumps from the frame by breaking a connecting portion of the bumps and the bridge.
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