Conductive, multilayer-structured resin particles and anisotropic conductive adhesives using the same

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United States of America Patent

PATENT NO 6352775
SERIAL NO

09629879

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Abstract

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The anisotropic conductive adhesives containing the conductive, multilayer-structured resin particles in which at least one inner layer is more flexible than the outermost layer and is chemically bound to at least one of the two adjacent layers and the surface of the outermost layer is covered with a metal make connections at lowered pressure enough to suppress development of cracking of the ITO electrode and also can provide enhanced stability, especially stability of connection over a prolonged period of time.

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Patent Owner(s)

Patent OwnerAddress
MITSUI TAKEDA CHEMICALS INCTOKYO JAPAN TOKYO METROPOLIS

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fujii, Tatsuo Shimizu, JP 57 845
Sasaki, Ichiro Osaka, JP 98 1529
Tachibana, Shinji Osaka, JP 24 153

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