Ingot support device for slicing silicon
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United States of America Patent
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-
Mar 5, 2002
Grant Date -
Dec 13, 2001
app pub date -
Jul 25, 2001
filing date -
Mar 8, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An ingot support device for slicing silicon is produced by molding a molding material obtained by blending an acrylic resin or an unsaturated polyester resin and one or more inorganic fillers selected from the group consisting of aluminum hydroxide, barium sulphate, barium carbonate, calcium carbonate and silica. According to the present invention, there is provided an ingot support device for slicing silicon which can be produced easily at a low cost, which has enough strength to cope with the upsizing of the ingot block, has high adhesive properties with the ingot block, and has other further improved properties which are required of the ingot support device for slicing silicon.
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