Semiconductor chip-substrate attachment structure
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United States of America Patent
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Feb 5, 2002
Issued Date -
N/A
app pub date -
Apr 28, 2000
filing date -
Aug 17, 1998
priority date (Note) -
Expired
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Abstract
A semiconductor device soldered to a conical mounting pedestal of a metal substrate reduces the lateral shearing stress created by temperature changes. An angle between the bonding surfaces of the semiconductor device and the metal substrate can be selected as a function of the coefficients of thermal expansion of the device and substrate materials.
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