Photosensitive resin composition, patterning method, and electronic components
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United States of America Patent
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Jan 29, 2002
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app pub date -
Sep 23, 1999
filing date -
Sep 23, 1999
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Abstract
A photosensitive resin composition comprising an aromatic polyimide precursor, wherein a 10 .mu.m thick layer of precursor has light transmittance at a wavelength of 365 nm of at least 1% and a 10 .mu.m thick polyimide film made from the resin composition by imidation ring closure and deposited on a silicon substrate results in a residual stress of at most 25 MPa. The composition can be patterned through i-line exposure followed by development with alkaline solutions, and can be imidized into low-stress polyimide patterns. Electronic components having the polyimide patterns have high reliability.
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