Positive photosensitive resin composition, method of forming relief pattern, and electronic part
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 22, 2002
Grant Date -
N/A
app pub date -
Feb 9, 2000
filing date -
Feb 9, 1999
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Positive photosensitive resin compositions, which comprise (A) a polyamidate having repetitive units of general formula (I) ##STR1## wherein R.sup.1 is a tetravalent organic group, R.sup.2 is a divalent organic group having a phenolic hydroxyl group, three R.sup.3 groups and three R.sup.4 groups each independently are an alkyl group or a hydrogen atom, and at least two R.sup.3 groups and at least two R.sup.4 groups are alkyl groups, and (B) a compound capable of generating an acid when exposed to light, are improved in storage stability and exposure sensitivity to i-line. Such compositions can improve the reliability of electronic parts when formed into surface-protecting films or interlayer insulating films by a method including exposure to i-line, development and heating.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully