Method of preparing thermally conductive compounds by liquid metal bridged particle clusters
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United States of America Patent
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Jan 15, 2002
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N/A
app pub date -
Apr 5, 2000
filing date -
Apr 5, 2000
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Abstract
A thermally conductive mechanically compliant pad including a quantity of gallium and/or indium alloy liquid at temperatures below about 120.degree. C. and a boron nitride particulate solid blended into the liquid metal alloy to form a paste. The paste is then combined with a quantity of a flowable plastic resin such as silicone oil to form the mechanically compliant pad, the compliant pad comprising from between about 10% and 90% of metallic coated particulate, balance flowable plastic resin.
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