Stackable QFN semiconductor package
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Jan 8, 2002
Grant Date -
N/A
app pub date -
Nov 17, 2000
filing date -
Nov 17, 2000
priority date (Note) -
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Abstract
A stackable QFN semiconductor package comprises a die, a lead frame, an electrical connection device, and a molding compound. The die has a plurality of bonding pads on its topside. The lead frame consists of a plurality of inner leads around edge of the die and each inner lead is divided into the body and the finger extending from the body. The body is thicker than the die and exposes its upper surface and lower surface for outer electrical connection of the package. The finger extends from the body to above the topside of the die. An electrical connection device connects the bonding pad of die and the finger of inner lead, thus electrically connect the die and the inner lead of lead frame. A molding compound seals around outer edge of the inner lead and seals off at least said electrical connection device; therefore provide ability of stack, thinner package and simplicity.
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