Semiconductor package with supported overhanging upper die
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United States of America Patent
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Jan 8, 2002
Grant Date -
N/A
app pub date -
Feb 16, 2000
filing date -
Feb 16, 2000
priority date (Note) -
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Abstract
A circuit assembly is provided with a lower die and an upper die offset and stacked on the lower die. A supporting material, such as a dielectric molding compound or epoxy resin, is dispensed along the side surfaces of the lower die under the overhanging parts of the upper die to provide support for the upper die, thereby preventing cracking of the upper die during wire bonding.
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