Electroplating installation, electrode and support device for this installation and electroplating process
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Jan 1, 2002
Issued Date -
N/A
app pub date -
Aug 14, 2000
filing date -
Dec 3, 1997
priority date (Note) -
Expired
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Abstract
An electroplating installation for coating the conducting surface of a part. The installation includes electrodes submerged in a bath. The electrodes rest on a support device that serves as a support and a current supply. The electrodes and the support device form an interface defining a plurality of grooves opening into the bath. The grooves may be formed in the electrodes, in the support device, or in both the electrodes and the support device.
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