Cup-type plating apparatus and method for plating wafer using the same
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United States of America Patent
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Dec 25, 2001
Grant Date -
N/A
app pub date -
Sep 24, 1999
filing date -
Jun 12, 1998
priority date (Note) -
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Abstract
A cup-type plating apparatus includes a plating tank having a support section provided on an upper end thereof for holding a wafer; a solution feed section provided at the center of a bottom portion of the plating tank; an anode disposed within the plating tank; and a diaphragm for separating the anode from the wafer. The diaphragm is slanted upward from the solution feed section toward the periphery of the plating tank. A gas release port is provided in the plating tank at such a position as to release bubbles collected under an upper end portion of the diaphragm.
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