Substrate having repaired metallic pattern and method and device for repairing metallic pattern on substrate
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United States of America Patent
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-
Dec 18, 2001
Issued Date -
N/A
app pub date -
Oct 15, 1998
filing date -
Oct 20, 1997
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Paste comprising metallic organic compound, in particular, gold-based metallic organic compound is used as a conductive material for repairing the broken defective part and is baked. This can produce a very thin metallic film having low electric resistance. Further, a semiconductor laser is used as a heating unit to heat only the broken defective part, and a heating profile having a baking process of provisional baking and main baking and a cooling process is provided to produce the high-quality thin metallic film having no crack and a dense texture.
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