Method and apparatus for temperature control of electrical devices mounted on circuit boards
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United States of America Patent
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-
Dec 11, 2001
Grant Date -
N/A
app pub date -
Mar 28, 2000
filing date -
Mar 28, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An enclosure for electronic equipment is constructed to orient a plurality of circuit boards in series of parallel slots with air-flow channels therebetween. Cooling air is delivered at constant pressure to inlet ends of each of the channels. Each channel is provided with a thermally sensitive air-flow restrictor at its outlet end. Each air-flow channel is thus provided with independent air temperature control. As a result, each circuit board slot can be utilized for a board with varying heat generating and air resistance characteristics. Each board is cooled properly irrespective of its power usage or shape. Additionally, the enclosures can be relocated to different environments having a wide range of ambient temperatures without adversely effecting the operational characteristics of components on the circuit boards.
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