Microporous copper film and electroless copper plating solution for obtaining the same
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United States of America Patent
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Dec 11, 2001
Grant Date -
N/A
app pub date -
Aug 23, 1999
filing date -
Feb 21, 1997
priority date (Note) -
Expired
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Abstract
A printed circuit board comprising a metal copper film having 10.sup.5 to 10.sup.9 micropores per square centimeter wherein the metal copper film is prepared by dipping a plating object into an electroless copper plating solution comprising a copper ion, a complexing agent, a hypophosphorus acid compound, a metallic catalyst for initiating the reductive reaction, and a compound containing an acetylenic bond.
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