Vertical spark gap for microelectric circuits
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 27, 2001
Grant Date -
N/A
app pub date -
Feb 9, 1999
filing date -
Feb 21, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A vertical spark gap assembly for electronic circuits employing poly silicon. The assembly permits dissipation of higher voltages in spark discharge without shorting in the circuit. The spark gap assembly includes a first partially conductive layer and a second partially conductive layer and a non-conductive material positioned between the layers and maintaining a vertically spaced apart relationship therebetween. At least one opening is provided in the first layer and the second layer with the non-conductive material removed from the layer having at least one opening. As such, the arrangement provides a vertical gap formed between and communicating with each layer.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully