Low dielectric constant materials with improved thermal and mechanical properties
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United States of America Patent
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Nov 27, 2001
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N/A
app pub date -
Oct 24, 1997
filing date -
Oct 24, 1997
priority date (Note) -
Expired
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Abstract
New starting materials and methods are used to make materials with low dielectric constant through the processes of transport polymerization or chemical vapor deposition. The starting materials and precursors are designed to provide polymers with combined low dielectric constant, high thermal stability and high mechanical strength.
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