Method of forming a wiring film
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United States of America Patent
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Nov 27, 2001
Grant Date -
N/A
app pub date -
Mar 9, 2000
filing date -
Mar 18, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of forming an intact wiring film by applying a filling treatment with a metal material with no pores to holes/trenches, the method comprising forming a barrier layer 3 to an insulation film 2 having holes/trenches 2A, forming a seed layer by a PVD method on the surface of the barrier layer and laminating a wiring film 5A by a electrolytic plating method and heat treating the same under a high temperature/high pressure gas atmosphere.
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