Integrated circuit board combining external contact zones and an antenna, and process for manufacturing such a board
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 20, 2001
Grant Date -
N/A
app pub date -
Sep 17, 1998
filing date -
Oct 7, 1997
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Integrated circuit board combining external contact zones and an antenna to receive data transmitted by a terminal, and process for manufacturing such a board. The integrated circuit board in accordance with the invention comprises a single integrated circuit connected both to an antenna by connection terminals and to external contact zones by other connection terminals; the antenna is arranged between a support and a strip; the above-mentioned connection terminals are arranged opposite the corresponding connection ends of the integrated circuit and are respectively connected to them; the integrated circuit is arranged by a process know by the name 'flip-chip' in a cavity in which the connection terminals of the antenna and those of the external contact zones are accessible. The board in accordance with the invention may by used both with a reader connected to the external contact zones or with a terminal transmitting data without contacts, by means of the antenna.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully