Semiconductor device having alternating electrically insulative coated leads
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United States of America Patent
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Nov 20, 2001
Issued Date -
N/A
app pub date -
Mar 23, 1994
filing date -
Apr 26, 1991
priority date (Note) -
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Abstract
A package for semiconductor devices is encapsulated in an insulating resin. Multiple conductive leads project from one side of the package. Alternating leads are provided with an insulating coating which projects along a portion of their length. Leads which are not insulated are bent so as to displace them from the plane of the coated leads and space them further away from the coated leads. The bent leads are displaced a sufficient distance to provide a separation in air consistent with spacing standards for high voltage devices.
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