Package comprising low application temperature hot melt adhesive comprising ethylene .alpha.-olefin
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Nov 20, 2001
Grant Date -
N/A
app pub date -
Feb 2, 2000
filing date -
Jul 22, 1996
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Abstract
Disclosed are packages, cartons, cases, and trays comprising a hot melt adhesive, in turn comprising at least one first homogenous linear or substantially linear ethylene polymer having a particular density and melt viscosity at 350.degree. F. (177.degree. C.), up to 60 weight percent wax and up to 40 weight percent tackifier. In particular, disclosed are packages, cartons, cases, and trays comprising a hot melt adhesive characterized by: a) at least one homogeneous linear or substantially linear interpolymer of ethylene with at least one C.sub.3 -C.sub.20 .alpha.-olefin interpolymer having a density from 0.850 g/cm.sup.3 to 0.895 g/cm.sup.3 ; and b) up to 60 weight percent of at least one tackifying resin; and c) up to 40 weight percent of at least one wax, wherein the hot melt adhesive has a viscosity of less than about 5000 cPs (50 grams/(cm.second)) at 150.degree. C.
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